Investigation of Reaction between Epoxy and 4-Phenyl 1-2, 6-Bis (4-Aminophenyl) Pyridine by Using FTIR and DSC Tools

Epoxy resins are widely utilized in a number of industrial application. Some of the many uses of epoxy resins can be found in the adhesive, coating, electronic industries due to the many excellent mechanical and chemical properties such as high tensile, compressive strength, good chemical and solvent resistance and high heat distortion temperature. The non-isothermal curing reaction of system consisting of an epoxy glue and synthesized 4-phenyl1-2, 6-bis (4-aminophenyl) pyridine was studied with a Fourier transform infrared (FTIR) and differential scanning calorimetry (DSC). From a kinetic study, some parameters such as rate constants and activation energy were determined. The method, based on graphic analysis of DSC test results, has been used to study a kinetic parameters. All dynamic DSC curves showed only one sharp exothermic peak, regardless of the heating rate, because the cure reaction between epoxide groups and primary or secondary amine groups took place in the same stage. For the kinetic analysis of the curing reaction, different concentration of the curing agent was investigated. DSC thermogram shifted to the lower temperature with increasing the amount this material and shifted to the higher temperature with increasing heating rate. The FTIR spectroscopy is a powerful tool to monitor the kinetic reaction of this epoxy. As can be seen, the degree of conversion increases when the intensity of the band at 915 cm-1 decrease.