Evaluation of Cooling High Temperature Electronic Devices with FEM and Experimental Method

Electronic devises are used in many industries, such as computers, telecommunication, home computer devises and other industrial application, Personal workstations have provided users with substantial in processing power over the past decade. Increasing memory size, graphic capability, and hard drive capacity, and much higher processor performance have all contributed to increase in capabilities, power and heat dissipation increased. In order to keep these processors and other critical component cool, traditional cooling systems are not sufficient, direct air cooling still remains an attractive method because of its mechanical simplicity. The problem is that conventional cooling techniques are no longer adequate. However, advanced methods are emerging that prevent overheating and offer other benefits as well. Novel structures such as miniature heat pipes, jet impingement cooling, thermoelectric coolers (solid-state refrigerators) liquid cold plate, as well as special fluids (liquid heat sink, direct immersion cooling) and packaging schemes, will take electronics to the densities and speeds that next generation application demand. subsequently using new liquid cooling systems are suggested here and their performance are described in this article, and we discus technologies that are in used to remove heat from electronic devises and achieve goal for efficiency, cost, and reliability. Cooling with natural convection and with liquid (water) cooling are compared together from different aspects with finite element method and also we do an experimental methods that results are in good agreement with theory. Previous researches are reviewed and new methods are described.