Title :
Time dependence of interface trap formation in MOSFETs following pulsed irradiation
Author :
Saks, N.S. ; Dozier, C.M. ; Brown, D.B.
Author_Institution :
US Naval Res. Lab., Washington, DC, USA
fDate :
12/1/1988 12:00:00 AM
Abstract :
The time dependence of interference trap (Nit) formation in MOSFETs was studied as a function of gate oxide thickness, oxide growth type, substrate orientation, temperature, and gate bias. Two different Nit formation mechanisms are observed. Most (typically 90%) of the formation, called the late process, occurs slowly at long times (1-10000 s) after the radiation pulse. From a variety of experimental data, it is concluded that the rate of the late process is limited by drift of a radiation-induced positive ion, probably H+ , through the gate oxide to the Si-SiO2 interface where the Nit are formed. A relatively fast, or early, process is responsible for a small percentage of the total Nit formation. The time constant for this process appears to be consistent with hole drift through the oxide
Keywords :
electron beam effects; insulated gate field effect transistors; interface electron states; semiconductor device testing; MOSFETs; Si-SiO2 interface; early process; electron irradiation; gate bias; gate oxide thickness; hole drift; interface trap formation; late process; oxide growth type; pulsed irradiation; radiation-induced positive ion; substrate orientation; temperature dependence; time constant; time dependence; Aluminum; Atomic measurements; Bonding; Hardware design languages; Hydrogen; Ionizing radiation; Laboratories; MOSFETs; Production; Silicon;
Journal_Title :
Nuclear Science, IEEE Transactions on