DocumentCode
1000695
Title
Formation of interface traps in MOSFETs during annealing following low temperature irradiation
Author
Saks, N.S. ; Klein, R.B. ; Griscom, D.L.
Author_Institution
US Naval Res. Lab., Washington, DC, USA
Volume
35
Issue
6
fYear
1988
fDate
12/1/1988 12:00:00 AM
Firstpage
1234
Lastpage
1240
Abstract
The formation of interface traps, Nit, was studied in MOSFETs during isochronal annealing up to 350 K, following exposure to ionizing radiation at 78 K. Two distinct Nit formation processes are observed. A small (1-10% of total) process occurs at 100-150 K, which is caused by neutral atomic hydrogen, and a second, higher-temperature (200-300 K) process that accounts for most ( >90%) of the Nit formation also occurs. The characteristics of the high-temperature process support the proton (H+) model of N it formation and are not in agreement with several other common models. Charge pumping and inversion layer mobility techniques for determining Nit are compared. It is found that the mobility cannot be used to determine Nit at 78 K (in contrast to its successful use at 295 K), probably because of lateral uniformities in the large radiation-induced fixed oxide charge
Keywords
annealing; gamma-ray effects; insulated gate field effect transistors; interface electron states; semiconductor device testing; 350 K; 78 K; MOSFETs; charge pumping; gamma irradiation; interface traps; inversion layer mobility; ionizing radiation; isochronal annealing; lateral uniformities; low temperature irradiation; proton model; radiation-induced fixed oxide charge; Annealing; Atomic measurements; Bonding; Charge measurement; Charge pumps; Current measurement; Hydrogen; Ionizing radiation; MOSFETs; Temperature;
fLanguage
English
Journal_Title
Nuclear Science, IEEE Transactions on
Publisher
ieee
ISSN
0018-9499
Type
jour
DOI
10.1109/23.25445
Filename
25445
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