• DocumentCode
    1000695
  • Title

    Formation of interface traps in MOSFETs during annealing following low temperature irradiation

  • Author

    Saks, N.S. ; Klein, R.B. ; Griscom, D.L.

  • Author_Institution
    US Naval Res. Lab., Washington, DC, USA
  • Volume
    35
  • Issue
    6
  • fYear
    1988
  • fDate
    12/1/1988 12:00:00 AM
  • Firstpage
    1234
  • Lastpage
    1240
  • Abstract
    The formation of interface traps, Nit, was studied in MOSFETs during isochronal annealing up to 350 K, following exposure to ionizing radiation at 78 K. Two distinct Nit formation processes are observed. A small (1-10% of total) process occurs at 100-150 K, which is caused by neutral atomic hydrogen, and a second, higher-temperature (200-300 K) process that accounts for most ( >90%) of the Nit formation also occurs. The characteristics of the high-temperature process support the proton (H+) model of N it formation and are not in agreement with several other common models. Charge pumping and inversion layer mobility techniques for determining Nit are compared. It is found that the mobility cannot be used to determine Nit at 78 K (in contrast to its successful use at 295 K), probably because of lateral uniformities in the large radiation-induced fixed oxide charge
  • Keywords
    annealing; gamma-ray effects; insulated gate field effect transistors; interface electron states; semiconductor device testing; 350 K; 78 K; MOSFETs; charge pumping; gamma irradiation; interface traps; inversion layer mobility; ionizing radiation; isochronal annealing; lateral uniformities; low temperature irradiation; proton model; radiation-induced fixed oxide charge; Annealing; Atomic measurements; Bonding; Charge measurement; Charge pumps; Current measurement; Hydrogen; Ionizing radiation; MOSFETs; Temperature;
  • fLanguage
    English
  • Journal_Title
    Nuclear Science, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9499
  • Type

    jour

  • DOI
    10.1109/23.25445
  • Filename
    25445