• DocumentCode
    1001150
  • Title

    Thin-film piezoelectric-on-silicon resonators for high-frequency reference oscillator applications

  • Author

    Abdolvand, Reza ; Lavasani, Hossein M. ; Ho, Gavin K. ; Ayazi, Farrokh

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Oklahoma State Univ., Stillwater, OK
  • Volume
    55
  • Issue
    12
  • fYear
    2008
  • fDate
    12/1/2008 12:00:00 AM
  • Firstpage
    2596
  • Lastpage
    2606
  • Abstract
    This paper studies the application of lateral bulk acoustic thin-film piezoelectric-on-substrate (TPoS) resonators in high-frequency reference oscillators. Low-motional impedance TPoS resonators are designed and fabricated in 2 classes--high-order and coupled-array. Devices of each class are used to assemble reference oscillators and the performance characteristics of the oscillators are measured and discussed. Since the motional impedance of these devices is small, the transimpedance amplifier (TIA) in the oscillator loop can be reduced to a single transistor and 3 resistors, a format that is very power-efficient. The lowest reported power consumption is ~350 muW for an oscillator operating at ~106 MHz. A passive temperature compensation method is also utilized bThis paper studies the application of lateral bulk acoustic thin-film piezoelectric-on-substrate (TPoS) resonators in high-frequency reference oscillators. Low-motionalimpedance TPoS resonators are designed and fabricated in 2 classes--high-order and coupled-array. Devices of each class are used to assemble reference oscillators and the performance characteristics of the oscillators are measured and discussed. Since the motional impedance of these devices is small, the transimpedance amplifier (TIA) in the oscillator loop can be reduced to a single transistor and 3 resistors, a format that is very power-efficient. The lowest reported power consumption is ~350 muW for an oscillator operating at ~106 MHz. A passive temperature compensation method is also utilized by including the buried oxide layer of the silicon-on-insulator (SOI) substrate in the structural resonant body of the device, and a very small (-2.4 ppm/degC) temperature coefficient of frequency is obtained for an 82-MHz oscillator.y including the buried oxide layer of the silicon-on-insulator (SOI) substrate in the structural resonant body of the device, and a very small (-2.4 ppm/degC) temperature coefficient of frequency is obtained for an 82-M- z oscillator.
  • Keywords
    acoustic impedance; acoustic resonators; crystal resonators; oscillators; piezoelectric thin films; bulk acoustic resonators; frequency 82 MHz; high-frequency reference oscillator; motional impedance; temperature compensation; thin film piezoelectric-on-silicon resonators; transimpedance amplifier; Acoustic applications; Acoustic devices; Acoustic measurements; Assembly; Impedance; Oscillators; Piezoelectric films; Power amplifiers; Resistors; Temperature; Acoustics; Algorithms; Electric Impedance; Electrochemistry; Electronics; Equipment Design; Mechanics; Microelectrodes; Micromanipulation; Nonlinear Dynamics; Oscillometry; Oxides; Silicon; Temperature; Transistors, Electronic;
  • fLanguage
    English
  • Journal_Title
    Ultrasonics, Ferroelectrics, and Frequency Control, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0885-3010
  • Type

    jour

  • DOI
    10.1109/TUFFC.2008.976
  • Filename
    4683468