DocumentCode :
1001904
Title :
A comparison study of symmetric ultrathin-body double-gate devices with metal source/drain and doped source/drain
Author :
Xiong, Shiying ; King, Tsu-Jae ; Bokor, Jeffrey
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of California, CA, Berkeley, USA
Volume :
52
Issue :
8
fYear :
2005
Firstpage :
1859
Lastpage :
1867
Abstract :
We have performed a simulation study of symmetric ultrathin-body double-gate (SUTBDG) devices with metal source/drain (S/D) structures designed for low-operating-power applications. A relatively high S/D Schottky barrier strongly influences the threshold voltages of the devices. The drive current (ION) is dominated by barrier tunneling for nonnegative SBHs. Both electrons and holes may contribute to the off-state current (IOFF). Tunneling from the drain terminal limits the minimum obtainable IOFF. Germanium channel devices with metal S/D and a given IOFF have smaller ION than similar silicon devices. With low nonnegative Schottky barrier heights (SBHs), metal S/D devices can outperform doped S/D devices, if the device performance degradation due to series resistances and parasitic capacitances is taken into account. Based on realistic device design rules, we have determined the upper bounds of S/D SBHs that allow metal S/D devices to offer improved performance over doped S/D devices with different body thicknesses.
Keywords :
MOSFET; Schottky barriers; tunnelling; Schottky barrier; barrier tunneling; doped source/drain; drive current; low-operating-power applications; metal source/drain; off-state current; parasitic capacitances; performance degradation; series resistance; symmetric ultrathin-body double-gate devices; threshold voltages; Charge carrier processes; Degradation; Germanium; MOSFET circuits; Parasitic capacitance; Schottky barriers; Silicon devices; Threshold voltage; Tunneling; Upper bound; Double-gate; Schottky barrier; metal source/drain (S/D); parasitic capacitance; series resistance;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2005.852893
Filename :
1468379
Link To Document :
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