• DocumentCode
    1002650
  • Title

    Power Semiconductor Device Figure of Merit for High-Power-Density Converter Design Applications

  • Author

    Wang, Hongfang ; Wang, Fred ; Zhang, Junhong

  • Author_Institution
    Virginia Polytech. Inst. & State Univ., Blacksburg
  • Volume
    55
  • Issue
    1
  • fYear
    2008
  • Firstpage
    466
  • Lastpage
    470
  • Abstract
    In order to help device selection and optimal application in high-power-density converter designs, a new power semiconductor device figure of merit (FOM)-power density FOM-is proposed, with consideration of power device conduction and switching losses, thermal characteristics, and package. The FOM is derived based on the device theory, and its validity and usefulness are demonstrated with a practical design example.
  • Keywords
    power semiconductor switches; semiconductor device packaging; switching convertors; electronics packaging; high-power-density converter design; power device conduction; power semiconductor device; semiconductor device figure-of-merit; switching losses; thermal characteristics; Capacitance; Electronic packaging thermal management; Power electronics; Power semiconductor devices; Semiconductor device packaging; Switching converters; Switching loss; Thermal conductivity; Thermal resistance; Voltage; Power converter; power density figure of merit (PDFOM); semiconductor power device;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2007.910573
  • Filename
    4399669