• DocumentCode
    1003164
  • Title

    Full band approach to tunneling in MOS structures

  • Author

    Sacconi, F. ; Di Carlo, Aldo ; Lugli, Paolo ; Städele, Martin ; Jancu, Jean-Marc

  • Volume
    51
  • Issue
    5
  • fYear
    2004
  • fDate
    5/1/2004 12:00:00 AM
  • Firstpage
    741
  • Lastpage
    748
  • Abstract
    Using atomistic quantum mechanical tight-binding (TB) methods that include the full band structure, we study electron tunneling through three-dimensional models of n+-Si/SiO2/p-Si capacitors with thicknesses between 0.7 and 4.4 nm. We find that the microscopic oxide structure influences transmission coefficients and tunnel currents significantly. The best agreement with experimental current-thickness and current-voltage data is obtained for a model derived from the β-cristobalite polytype of SiO2 that has a fairly small conduction band mass of 0.34 m0. Standard approximate effective mass-based methods reproduce the TB results only if an energy and oxide thickness dependence of the mass parameter is introduced.
  • Keywords
    MOS capacitors; tight-binding calculations; tunnelling; MOS structures; Si-SiO2-Si; atomistic quantum mechanical TB methods; capacitors; current-thickness data; current-voltage data; electron tunneling; full band simulations; full band structure; metal-oxide-semiconductor; microscopic oxide structure; three-dimensional models; tight-binding; transmission coefficients; tunnel currents; Atomic layer deposition; Bonding; Electrons; FETs; MOS capacitors; Microscopy; Nanoscale devices; Prototypes; Quantum mechanics; Tunneling; MOS; Metal–oxide–semiconductor; TB; full band simulations; tight-binding; tunneling;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2004.826862
  • Filename
    1303833