DocumentCode
1007396
Title
High dielectric constant thin film EBG power/ground network for broad-band suppression of SSN and radiated emissions
Author
Lee, Junho ; Kim, Hyungsoo ; Kim, Joungho
Author_Institution
Dept. of Electr. Eng., Korea Adv. Inst. of Sci. & Technol., Daejeon, South Korea
Volume
15
Issue
8
fYear
2005
Firstpage
505
Lastpage
507
Abstract
We experimentally demonstrated the great advantages of a high dielectric constant thin film electromagnetic bandgap (EBG) power distribution network (PDN) for the suppression of power/ground noises and radiated emissions in high-performance multilayer digital printed circuit boards (PCBs). Five-layer test PCBs were fabricated and their scattering parameters measured. The power plane noise and radiated emissions were measured, investigated and related to the PDN impedance. This successfully demonstrated that the bandgap of the EBG was extended more than three times, covering a range of hundreds of MHz using a 1-cm × 1-cm EBG cell, the SSN was reduced from 170 mV to 10 mV and the radiated emission was suppressed by 22 dB because of the high dielectric constant thin film EBG power/ground network.
Keywords
S-parameters; dielectric thin films; interference suppression; permittivity; photonic band gap; printed circuit manufacture; printed circuit testing; printed circuits; 10 mV; 170 mV; 22 dB; PDN impedance; broadband suppression; dielectric constant; electromagnetic bandgap; ground noise; multilayer digital printed circuit board; power distribution network; power noise; radiated emissions; scattering parameter; simultaneous switching noise; thin film; Circuit noise; Dielectric measurements; Dielectric thin films; Digital printing; Electromagnetic interference; Electromagnetic measurements; High-K gate dielectrics; Nonhomogeneous media; Power systems; Thin film circuits; Electromagnetic bandgap (EBG); power distribution network impedance; radiated emission; simultaneous switching noise (SSN);
fLanguage
English
Journal_Title
Microwave and Wireless Components Letters, IEEE
Publisher
ieee
ISSN
1531-1309
Type
jour
DOI
10.1109/LMWC.2005.852779
Filename
1471725
Link To Document