Abstract :
On May 22-24, 1974, the Computer Society´s Technical Committee on Packaging held its biannual workshop. Attendance was 55 from an invited list of about 70 consisting of the active members of the Computer Packaging Committee and the invited speaker attendees. Held this year at Split Rock Lodge in Lake Harmony, Pennsylvania, the workshop customarily has five sessions: one at the chip-to-package interface, one aimed at the hybrid circuit interconnection level, one at the computer backplane and cabinet wiring level, one of general interest to the manufacturing technology that cuts across all types of computer manufacturing apparatus,and a fifth that is especially chosen for each conference as an item of importance or special interest that is not covered by any other session.
