Title :
Seventh IEEE International Conference on Wafer Scale Integration
fDate :
8/1/1995 12:00:00 AM
Abstract :
The following topics were dealt with: WSI applications; architecture; interconnect and routing; yield and test
Keywords :
integrated circuit design; integrated circuit interconnections; integrated circuit testing; integrated circuit yield; network routing; wafer-scale integration; WSI applications; architecture; interconnect; routing; test; wafer scale integration; yield;
Journal_Title :
Components, Packaging, and Manufacturing Technology, Part B: Advanced Packaging, IEEE Transactions on
