Title :
Thermal cycling stability of lead-alloy Josephson junctions with double layer base electrodes
Author :
Imamura, T. ; Hasuo, S. ; Yamaoka, T.
Author_Institution :
Fujitsu Limited, Atsugi, Japan
fDate :
3/1/1985 12:00:00 AM
Abstract :
In this paper, Josephson junctions with double layer base electrodes are proposed, and their thermal cycling stability is reported. The double layer base electrode has been made of a thick Nb lower film and a thin Pb-In-Au upper film prepared at 77K. The thermal cycling experiment has been carried out for 11780 junctions, and their excellent cycling stability has been observed.
Keywords :
Josephson devices; Electrodes; Gold; Grain size; Josephson junctions; Semiconductor films; Substrates; Surface morphology; Thermal stability; Thermal stresses; X-ray diffraction;
Journal_Title :
Magnetics, IEEE Transactions on
DOI :
10.1109/TMAG.1985.1063826
