• DocumentCode
    1011976
  • Title

    Multi-chip modules for military and adverse environment applications

  • Author

    Port, R.M.

  • Author_Institution
    Hughes Aircraft Co., Los Angeles, CA, USA
  • Volume
    8
  • Issue
    9
  • fYear
    1993
  • Firstpage
    17
  • Lastpage
    19
  • Abstract
    Some of the design, inspection, and test trade-offs involved in creating modern high-performance multichip modules (MCMs) for both military and high-end commercial applications with an adverse environment are covered. Design features and qualification tests are discussed. Some more cost-effective MCM testing possibilities are examined.<>
  • Keywords
    built-in self test; environmental testing; inspection; integrated circuit technology; integrated circuit testing; military equipment; military standards; multichip modules; Hughes; MCMs; adverse environment; commercial applications; design; inspection; military applications; multichip modules; qualification tests; test; Assembly; Circuit testing; Costs; Inspection; Lead; Military aircraft; Packaging; Qualifications; System testing; Temperature;
  • fLanguage
    English
  • Journal_Title
    Aerospace and Electronic Systems Magazine, IEEE
  • Publisher
    ieee
  • ISSN
    0885-8985
  • Type

    jour

  • DOI
    10.1109/62.257113
  • Filename
    257113
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1011976