Title :
Multi-chip modules for military and adverse environment applications
Author_Institution :
Hughes Aircraft Co., Los Angeles, CA, USA
Abstract :
Some of the design, inspection, and test trade-offs involved in creating modern high-performance multichip modules (MCMs) for both military and high-end commercial applications with an adverse environment are covered. Design features and qualification tests are discussed. Some more cost-effective MCM testing possibilities are examined.<>
Keywords :
built-in self test; environmental testing; inspection; integrated circuit technology; integrated circuit testing; military equipment; military standards; multichip modules; Hughes; MCMs; adverse environment; commercial applications; design; inspection; military applications; multichip modules; qualification tests; test; Assembly; Circuit testing; Costs; Inspection; Lead; Military aircraft; Packaging; Qualifications; System testing; Temperature;
Journal_Title :
Aerospace and Electronic Systems Magazine, IEEE
