Title :
Efficient Full-Wave Analysis of Multilayer Interconnection Structures Using a Novel Domain Decomposition–Model-Order Reduction Method
Author :
Lee, Shih-Hao ; Jin, Jian-Ming
Author_Institution :
Univ. of Illinois at Urbana-Champaign, Urbana
Abstract :
A novel domain decomposition-model-order reduction method is proposed for efficient full-wave finite-element analysis of multilayer interconnection structures. By considering the special properties of a multilayer structure, the field at each nonmetallic interface (via-holes or other apertures) can be approximated with a modal expansion to establish a boundary condition and decompose the entire computational domain into separate layers. The coupling between each dielectric layer is taken into account through a mode-matching process. To further speed up the computation in each layer, the solution space projection, which is a multipoint model-order reduction method, is integrated into the aforementioned domain decomposition method to form a complete solution algorithm. With the aid of reduced-order models, the domain decomposition process at each frequency is accelerated and a fast broadband analysis is achieved. This domain decomposition-model-order reduction method, called approximate modal interface-solution space projection, is implemented using the finite-element method and validated through several examples, which demonstrate the efficiency of the method in both the computation time and memory usage.
Keywords :
finite element analysis; interconnections; mode matching; printed circuits; reduced order systems; computation time; decomposition-model-order reduction method; full-wave finite-element analysis; memory usage; mode-matching process; multilayer interconnection structures; Acceleration; Computer interfaces; Finite difference methods; Finite element methods; Frequency; Integrated circuit interconnections; Nonhomogeneous media; Printed circuits; Reduced order systems; Time domain analysis; Domain decomposition; finite-element method (FEM); full-wave analysis; model-order reduction; printed circuit board (PCB); via-hole;
Journal_Title :
Microwave Theory and Techniques, IEEE Transactions on
DOI :
10.1109/TMTT.2007.912192