Title :
The preparation of semiconductor devices by lapping and diffusion techniques
Author_Institution :
RCA Laboratories, Princeton, N.J, USA
fDate :
4/1/1958 12:00:00 AM
Keywords :
Contacts; Contracts; Electric variables; Electrons; Fabrication; Lapping; Packaging; Photoconducting devices; Photoconductivity; Semiconductor devices; Semiconductor diodes; Silicon; Temperature;
Journal_Title :
Electron Devices, IRE Transactions on
DOI :
10.1109/T-ED.1958.14376
