Title :
Failure mechanism models for plastic deformation
Author :
Dasgupta, Abhijit ; Hu, Jun Ming
Author_Institution :
CALCE Electron. Package Res. Center, Maryland Univ., College Park, MD, USA
fDate :
6/1/1992 12:00:00 AM
Abstract :
A tutorial illustrating designs in which plastic deformation can endanger system performance, thereby acting as an overstress failure mechanism, is presented. Analytic methods, based on continuum mechanics, are presented to design against such failures. Examples illustrate the use of these models in practical designs encountered in mechanical systems and in electronic packaging
Keywords :
classical mechanics of continuous media; failure analysis; packaging; plastic deformation; reliability theory; continuum mechanics; electronic packaging; mechanical systems; overstress failure mechanism; plastic deformation; reliability; tutorial; Crystalline materials; Crystallization; Deformable models; Design engineering; Educational institutions; Failure analysis; Lattices; Plastics; Reliability engineering; System performance;
Journal_Title :
Reliability, IEEE Transactions on
