• DocumentCode
    1014139
  • Title

    Failure-mechanism models for creep and creep rupture

  • Author

    Li, Junhui ; Dasgupta, Abhijit

  • Author_Institution
    CALCE Electron. Packaging Res. Center, Maryland Univ., College Park, MD, USA
  • Volume
    42
  • Issue
    3
  • fYear
    1993
  • fDate
    9/1/1993 12:00:00 AM
  • Firstpage
    339
  • Lastpage
    353
  • Abstract
    This tutorial illustrates design situations where creep and creep rupture of components can compromise system performance over time, thereby acting as a wearout failure mechanism. Polycrystalline materials, such as metals and ceramics, and polymers are treated. Analytic microstructural creep mechanisms leading to failure of these materials are presented. Continuum microscale models for predicting long-term creep are explained for practical design purposes. Two examples illustrate these models for mechanical engineering and electronic packaging situations
  • Keywords
    ceramics; creep; creep fracture; failure analysis; mechanical engineering; metals; packaging; polymers; reliability theory; analytical models; ceramics; continuum microscale models; creep rupture; electronic packaging; long-term creep; mechanical engineering; metals; microstructural creep mechanisms; polycrystalline materials; polymers; tutorial; wearout failure mechanism; Ceramics; Creep; Deformable models; Electronics packaging; Failure analysis; Plastics; Polymers; Reliability engineering; Stress; Temperature;
  • fLanguage
    English
  • Journal_Title
    Reliability, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9529
  • Type

    jour

  • DOI
    10.1109/24.257816
  • Filename
    257816