DocumentCode

1014144

Title

Compression bonding techniques for lead connections to rugged high-frequency transistors

Author

Light, T.B.

Author_Institution

Bell Telephone Laboratories, Inc., Murray Hill, N. J.

Volume

6

Issue

2

fYear

1959

fDate

4/1/1959 12:00:00 AM

Firstpage

252

Lastpage

252

Keywords

Alloying; Bonding; Cathodes; Detectors; Electric shock; Electrodes; Germanium; Gold; Indium; Infrared detectors; Packaging; Protection; Silicon; Temperature; Testing;

fLanguage

English

Journal_Title

Electron Devices, IRE Transactions on

Publisher

ieee

ISSN

0096-2430

Type

jour

DOI

10.1109/T-ED.1959.14534

Filename

1472577