Title :
Compression bonding techniques for lead connections to rugged high-frequency transistors
Author_Institution :
Bell Telephone Laboratories, Inc., Murray Hill, N. J.
fDate :
4/1/1959 12:00:00 AM
Keywords :
Alloying; Bonding; Cathodes; Detectors; Electric shock; Electrodes; Germanium; Gold; Indium; Infrared detectors; Packaging; Protection; Silicon; Temperature; Testing;
Journal_Title :
Electron Devices, IRE Transactions on
DOI :
10.1109/T-ED.1959.14534
