Considering the Future of Microsystems Technology on the Occasion of DARPA´s 50th Anniversary

Author

Leheny, R.F.

Volume

96

Issue

11

fYear

2008

Firstpage

1746

Lastpage

1748

Abstract

The paper presents the challenges in the field of microsystems technology development of the Defense Advanced Research Projects Agency (DARPA) for its future projects. Among them are: the challenge of maintaining and exploiting the opportunities embodied by Moore´s law; exploiting precision materials deposition and control over composition and device structure of semiconductor material to attain the highest possible frequency and circuit speed; managing the properties of infrared materials, exploiting the advances in IC manufacturing; and harnessing the advances in photonics.

Keywords

integrated circuits; military equipment; military systems; semiconductor technology; DARPA; Defense Advanced Research Projects Agency; IC manufacturing; Moore law; circuit speed; highest possible frequency; infrared materials; microsystems technology; photonics; precision material; semiconductor material; Application specific integrated circuits; Investments; Microelectronics; Microwave transistors; Moore´s Law; Semiconductor materials; Sensor arrays; Sensor systems; Surface emitting lasers; Vertical cavity surface emitting lasers;

fLanguage

English

Journal_Title

Proceedings of the IEEE

Publisher

ieee

ISSN

0018-9219

Type

jour

DOI

10.1109/JPROC.2008.2004307

Filename

4694024