Title :
Characterization of the broadband transmission behavior of interconnections on silicon substrates
Author :
Zaage, Stefan ; Grotelüschen, Enno
Author_Institution :
Lab. fur Informationstech., Hannover Univ., Germany
fDate :
11/1/1993 12:00:00 AM
Abstract :
In this paper some characteristics of the transmission behavior of interconnections on conductive silicon substrates are presented. With regard to the signal propagation in high-speed digital circuits, the broadband behavior of the lines is of special interest. The characteristic impedance ZC and the propagation constant γ of the lines are determined experimentally by microwave measurements. The influence of the line geometry, the substrate resistivity, and the signal frequency on the transmission behavior are clarified. Based on the results of these measurements, the suitability of the conventional RLC line model for time-domain simulations of the transmission characteristics of interconnections on silicon substrates is clarified
Keywords :
VLSI; digital integrated circuits; electric impedance; microstrip lines; multichip modules; packaging; silicon; substrates; transmission line theory; RLC line model; Si; Si substrate; broadband transmission behavior; characteristic impedance; characterization; conductive substrates; high-speed digital circuits; interconnections; line geometry; microwave measurements; propagation constant; signal frequency; signal propagation; substrate resistivity; time-domain simulations; Conductivity; Digital circuits; Frequency; Geometry; Impedance measurement; Integrated circuit interconnections; Microwave measurements; Microwave propagation; Propagation constant; Silicon;
Journal_Title :
Components, Hybrids, and Manufacturing Technology, IEEE Transactions on
