Title :
A high-speed complementary silicon bipolar technology with 12-fJ power-delay product
Author :
Cressler, John D. ; Warnock, James ; Harame, David L. ; Burghartz, Joachim N. ; Jenkins, Keith A. ; Chuang, Ching-Te
Author_Institution :
Dept. of Electr. Eng., Auburn Univ., AL, USA
Abstract :
A complementary silicon bipolar technology offering a substantial improvement in power-delay performance over conventional n-p-n-only bipolar technology is demonstrated. High-speed n-p-n and p-n-p double-polysilicon, self-aligned transistors were fabricated in a 20-mask-count integrated process using an experimental test site designed specifically for complementary bipolar applications. N-p-n and p-n-p transistors with 0.50- mu m emitter widths have cutoff frequencies of 50 GHz and 13 GHz, respectively. Two novel complementary bipolar circuits-AC-coupled complementary push-pull ECL, and NTL with complementary emitter-follower-display a significant advantage in power dissipation as well as gate delay when compared to conventional n-p-n-only ECL circuits. Record power-delay products of 34 fJ (23.2 ps at 1.48 mW) and 12 fJ (19.0 ps at 0.65 mW) were achieved for these unloaded complementary circuits, respectively. These results demonstrate the feasibility and resultant performance leverage of high-speed complementary bipolar technologies.<>
Keywords :
bipolar integrated circuits; digital integrated circuits; elemental semiconductors; emitter-coupled logic; integrated circuit technology; integrated logic circuits; silicon; 0.65 mW; 1.48 mW; 12 fJ; 13 GHz; 19 ps; 20-mask-count integrated process; 23.2 ps; 34 fJ; 50 GHz; AC-coupled complementary push-pull ECL; NTL; Si; bipolar technology; complementary bipolar circuits; complementary emitter-follower; cutoff frequencies; double-polysilicon; gate delay; high-speed complementary process; power dissipation; power-delay performance; power-delay product; self-aligned transistors; Automatic testing; Bipolar transistors; CMOS logic circuits; CMOS technology; Circuit testing; Integrated circuit technology; Isolation technology; Power dissipation; Silicon on insulator technology; Very large scale integration;
Journal_Title :
Electron Device Letters, IEEE