DocumentCode :
1016367
Title :
Special Issue on Packaging Reliability
Volume :
54
Issue :
7
fYear :
2007
fDate :
7/1/2007 12:00:00 AM
Firstpage :
1807
Lastpage :
1807
Abstract :
Provides notice of upcoming special issue(s) of interest to practitioners and researchers.
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2007.902566
Filename :
4252376
Link To Document :
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