Title :
A hermetically-sealed encapsulation for microwave junction diodes
Author :
Boore, E.J. ; Elder, H.E.
Author_Institution :
Bell Telephone Labs., Inc., Allentown, Pa.
fDate :
3/1/1961 12:00:00 AM
Keywords :
Alloying; Capacitance; Circuit testing; Circuits; Diodes; Encapsulation; Fabrication; Germanium; Klystrons; Microwave amplifiers; Noise figure; Power generation; Refrigeration; Semiconductor diodes; Temperature; Thermoelectricity; Tunable circuits and devices;
Journal_Title :
Electron Devices, IRE Transactions on
DOI :
10.1109/T-ED.1961.14768
