DocumentCode :
1016506
Title :
Oxide-Trapped Charges Induced by Electrostatic Discharge Impulse Stress
Author :
Tseng, Jen-Chou ; Hwu, Jenn-Gwo
Author_Institution :
Nat. Taiwan Univ., Taipei
Volume :
54
Issue :
7
fYear :
2007
fDate :
7/1/2007 12:00:00 AM
Firstpage :
1666
Lastpage :
1671
Abstract :
The characteristics of oxide-trapped charges Qot induced by electrostatic discharge high-field current impulse stress, i.e., transmission line pulsing (TLP), were studied. It was observed that for a 3.2-nm-thin oxide, the centroid evolution and the critical density of positive oxide-trapped charges Qot + to trigger oxide breakdown are about the same between dc and TLP impulse stresses. These results are consistent with the existing models of stress-induced trapping charges and hole-induced oxide breakdown. However, different behaviors of Qot and centroid were found for 14-nm-thick oxides subjected to different stress tests. TLP impulse stress generates far less amount of negative oxide- trapped charges Qot - than dc stress, and the positive oxide-trapped charges finally dominate over the negative oxide-trapped charges. This impulse stress imposes a high density and transient current on the oxide, which induces traps at the tunneling distance locally. The hotter injected electrons generate more efficient hole trappings to provoke breakdown with lower density of oxide-trapped charges in comparison with dc stress test.
Keywords :
MOS capacitors; electrostatic discharge; hot carriers; semiconductor device breakdown; semiconductor device reliability; stress effects; MOS devices; electrostatic discharge impulse stress; hole trappings; hot injected electrons; oxide breakdown; oxide-trapped charges; size 14 nm; size 3.2 nm; stress test; transmission line pulsing; Charge carrier processes; DC generators; Electric breakdown; Electron traps; Electrostatic discharge; Power system transients; Stress; Testing; Transmission lines; Tunneling; Electrostatic discharge (ESD); MOS devices; gate dielectrics; oxide-trapped charges; semiconductor device reliability; transmission line pulsing (TLP);
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/TED.2007.899429
Filename :
4252388
Link To Document :
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