DocumentCode :
1017184
Title :
Suppression of Microwave Resonances in Wirebond Transitions Between Conductor-Backed Coplanar Waveguides
Author :
Lim, JuHwan ; Kim, GyoungBum ; Hwang, Sungwoo
Author_Institution :
Korea Univ., Seoul
Volume :
18
Issue :
1
fYear :
2008
Firstpage :
31
Lastpage :
33
Abstract :
Suppression of microwave resonances in wirebond transitions is reported. The transition is made between conductor-backed coplanar waveguides on two different substrates (alumina and silicon), and multiple wirebonds connecting two grounds on each substrate are shown to remove the resonances. It is shown that this additional wirebonding eliminates the nodes which are responsible for the unwanted resonant modes with the frequencies far below the first resonant frequency (19 GHz) of the single substrates. Our work is a unique demonstration of using multiple wirebonds for the removal of resonances.
Keywords :
coplanar waveguides; microstrip filters; microwave filters; resonance; conductor-backed coplanar waveguides; microwave resonances suppression; resonant frequency; unwanted resonant modes; wirebond transitions; wirebonding; Conductors; Coplanar waveguides; Gold; Joining processes; Nanoscale devices; Resonance; Resonant frequency; Silicon; Waveguide transitions; Wire; Conductor-backed coplanar waveguide (CBCPW); resonance; transition; wirebond;
fLanguage :
English
Journal_Title :
Microwave and Wireless Components Letters, IEEE
Publisher :
ieee
ISSN :
1531-1309
Type :
jour
DOI :
10.1109/LMWC.2007.911985
Filename :
4407752
Link To Document :
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