DocumentCode
1017345
Title
High-performance TFTs fabricated on plastic substrates
Author
Lemmi, F. ; Chung, W. ; Lin, S. ; Smith, P.M. ; Sasagawa, T. ; Drews, B.C. ; Hua, A. ; Stern, J.R. ; Chen, J.Y.
Author_Institution
FlexICs Inc., Milpitas, CA, USA
Volume
25
Issue
7
fYear
2004
fDate
7/1/2004 12:00:00 AM
Firstpage
486
Lastpage
488
Abstract
Poly-Si thin-film transistors (TFTs) have recently been introduced to commercial glass flat-panel displays. This letter presents a manufacturable process for fabricating poly-Si TFTs directly on plastic substrates that exceed TFT parameter requirements for active-matrix displays. Plastic sheets are laminated onto carrier wafers, to allow use of automated tools for manufacturing. In order to maintain adhesion through the whole process, the wafer temperature is kept below 105°C. Laser crystallization is used to grow poly-Si, and a quarter-wavelength stack layer is deposited to protect plastic from the laser processing. In order to achieve state-of-the-art poly-Si TFTs on plastic, the gate oxide is optimized. Using a higher temperature anneal after delamination minimizes leakage currents.
Keywords
flat panel displays; plastics; substrates; thin film transistors; active-matrix displays; carrier wafers; delamination; excimer lasers; gate oxide optimization; glass flat-panel displays; high-temperature anneal; laser crystallization; laser processing; leakage currents; plastic films; plastic sheets; plastic substrates; poly-Si TFT; thin-film transistor; Active matrix technology; Adhesives; Displays; Glass; Manufacturing automation; Manufacturing processes; Plastics; Substrates; Temperature; Thin film transistors; Excimer lasers; TFTs; flat-panel displays; plastic films; thin-film transistors;
fLanguage
English
Journal_Title
Electron Device Letters, IEEE
Publisher
ieee
ISSN
0741-3106
Type
jour
DOI
10.1109/LED.2004.831208
Filename
1308428
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