Operation time control of a high density packaging using a low melting point alloy

Author

Ishizuka, Masaru

Author_Institution

Mech. Syst. Eng. Dept., Toyama Prefectural Univ., Japan

Volume

27

Issue

2

fYear

2004

fDate

6/1/2004 12:00:00 AM

Firstpage

239

Lastpage

243

Abstract

This paper describes a concept of controlling operation time of a high-density packaging using a phase change material (PCM). A low cost alloy, which is composed of Bi/Pb/Sn/In and having melting point less than 343 K, was used as the PCM. Thermal experiments using the alloy were carried out and it was confirmed that the substrate back surface temperature could be kept constant at the melting temperature of the PCM for several minutes by thermal absorption, while the PCM phase changed from its original solid state into the liquid state. Also, in the present work, it was confirmed that thermal network method is practically useful for the thermal design of a package with a PCM.

Keywords

bismuth alloys; indium alloys; lead alloys; melting point; phase transformations; thermal management (packaging); tin alloys; Bi-Pb-Sn-In; PCM; high density packaging; low cost alloy; low melting point alloy; melting temperature; operation time control; phase change material; substrate back surface temperature; thermal absorption; thermal design; thermal network; Application software; Costs; Electronic packaging thermal management; Phase change materials; Steady-state; Temperature; Thermal conductivity; Thermal management; Thermal resistance; Wearable computers; High density packaging cooling phase change material; low melting point alloy; operation time control; thermal network method;

fLanguage

English

Journal_Title

Components and Packaging Technologies, IEEE Transactions on

Publisher

ieee

ISSN

1521-3331

Type

jour

DOI

10.1109/TCAPT.2004.828586

Filename

1308443