DocumentCode
1017634
Title
Solder-assembled high coupling efficiency single-mode laser modules using micro-heaters and precompensation technique
Author
Datta, Madhumita ; Dagenais, Mario
Author_Institution
Dept. of Electr. & Comput. Eng., Univ. of Maryland, College Park, MD, USA
Volume
27
Issue
2
fYear
2004
fDate
6/1/2004 12:00:00 AM
Firstpage
305
Lastpage
310
Abstract
In this paper, we are proposing a hybrid integration platform, on which a single-mode lensed fiber can be actively aligned to a semiconductor laser, and then solder-attached to the platform with the help of on-board thin-film heaters. We have demonstrated 50% coupling efficiency with conically lensed single-mode fibers, bonded with gold-tin (AuSn) eutectic solder. The loss of alignment due to solder solidification has been carefully measured and compensated during the subsequent correctional alignment step taking advantage of the reworkability feature of the solder-joint. Two types of fiber sub-assemblies have been tested: uncoated bare fiber housed within a metallized ceramic ferrule, and nickel/gold coated bare fiber directly solder-bonded to the platform. Statistical data confirms that in both the cases, 95% of the loss of original coupling was restored by the precompensation technique.
Keywords
eutectic alloys; gold alloys; modules; optical fibres; semiconductor lasers; soldering; statistical analysis; thin films; tin alloys; AuSn; active alignment; eutectic solder; fiber sub-assemblies; high coupling efficiency; hybrid integration; metallized ceramic ferrule; on-board thin-film heaters; precompensation technique; semiconductor laser; single-mode laser modules; single-mode lensed fiber; solder attachment; solder solidification; solder-joint; statistical data; thin-film microheaters; Bonding; Ceramics; Fiber lasers; Loss measurement; Metallization; Nickel; Optical coupling; Optical fiber testing; Semiconductor lasers; Semiconductor thin films; Active alignment; lensed fiber; precompensation technique; solder attachment; thin-film microheaters;
fLanguage
English
Journal_Title
Components and Packaging Technologies, IEEE Transactions on
Publisher
ieee
ISSN
1521-3331
Type
jour
DOI
10.1109/TCAPT.2004.828571
Filename
1308451
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