DocumentCode :
1017674
Title :
Thermal analysis of a channel containing multiple heated obstacles with localized heat generations
Author :
Alawadhi, Esam M.
Author_Institution :
Dept. of Mech. Eng., Kuwait Univ., Safat, Kuwait
Volume :
27
Issue :
2
fYear :
2004
fDate :
6/1/2004 12:00:00 AM
Firstpage :
327
Lastpage :
336
Abstract :
This paper studies conjugate heat transfer for two-dimensional, developing flows over an array of multiple rectangular obstacles with localized heat generations. The paper focuses on the spatial distributions of Nusselt number and temperature along the solid/fluid interface, as well as the maximum temperature of the obstacles. The results are compared to uniform heat generation configuration to validate the approach of approximating the local heat generation as uniform. A finite element technique is utilized to solve the governing equations, along with boundary conditions for a wide range of Reynolds numbers and obstacles´ thermal conductivities. At certain conditions, the numerical results showed that the uniform heat generation approach could lead to a significant analysis error. When the obstacles´ thermal conductivity and Reynolds number are low, the uniform heat generation approach becomes invalid. The average Nusselt number and maximum temperature of the obstacles for the localized heat generation configuration are fully documented.
Keywords :
finite element analysis; heat transfer; thermal analysis; thermal conductivity; thermal management (packaging); Nusselt number; Reynolds numbers; conjugate heat transfer; finite element; fluid interface; heat generation configuration; multiple heated obstacles; multiple rectangular obstacles; solid interface; spatial distributions; thermal analysis; thermal conductivity; Electronic packaging thermal management; Electronics cooling; Finite element methods; Heat transfer; Shape; Solids; Temperature distribution; Thermal conductivity; Thermal management; Thermal stresses; Conjugate heat transfer; Nusselt number; Reynolds number; finite element technique; solid/fluid interface; thermal conductivity;
fLanguage :
English
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
Publisher :
ieee
ISSN :
1521-3331
Type :
jour
DOI :
10.1109/TCAPT.2004.828564
Filename :
1308454
Link To Document :
بازگشت