Title :
Moisture absorption in uncured underfill materials
Author :
Luo, Shijian ; Wong, C.P.
Author_Institution :
Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA
fDate :
6/1/2004 12:00:00 AM
Abstract :
This paper presents a systematic study on moisture absorption in uncured underfill based on epoxy cured with acid anhydride [methylhexahydrophthalic anhydride (MHHPA)] and epoxy cured with non-acid anhydride curing agent. The influence of absorbed moisture on curing properties, thermomechanical property, and adhesion property of underfill after curing has been investigated. For epoxy cured with non-acid anhydride, the moisture absorption is low, and the absorbed moisture has no significant effect on the properties of cured underfill materials. For epoxy cured with acid anhydride, the moisture absorption before curing can be more than 2.0%, and the absorbed moisture can affect the properties significantly. The absorbed moisture can catalyze the curing reaction between acid anhydride and epoxy. The glass transition temperature of the cured samples is reduced after the underfill absorbs the moisture before curing. The adhesion strength decreases dramatically after the underfill absorbs the moisture before curing.
Keywords :
adhesive bonding; adsorption; curing; epoxy insulation; flip-chip devices; integrated circuit packaging; moisture; absorbed moisture; acid anhydride curing; adhesion properties; adhesion strength; cured underfill; curing properties; curing reaction; epoxy underfill; flip chip devices; glass transition temperature; moisture absorption; nonacid anhydride curing; thermomechanical properties; uncured underfill; Absorption; Adhesives; Assembly; Curing; Electronic packaging thermal management; Flip chip; Moisture; Soldering; Thermal stresses; Thermomechanical processes; Adhesion; epoxy; moisture absorption; underfill;
Journal_Title :
Components and Packaging Technologies, IEEE Transactions on
DOI :
10.1109/TCAPT.2004.828562
