DocumentCode :
1017792
Title :
A new technique for forming a shallow link base in a double polysilicon bipolar transistor
Author :
Hayden, J.D. ; Burnett, J.D. ; Pfiester, J.R. ; Woo, M.P.
Author_Institution :
Adv. Products Res. & Dev. Lab., Motorola Inc., Austin, TX, USA
Volume :
41
Issue :
1
fYear :
1994
fDate :
1/1/1994 12:00:00 AM
Firstpage :
63
Lastpage :
68
Abstract :
A new technique is presented for forming a shallow link base in a double polysilicon bipolar transistor. This method is easily integrated into an advanced BiCMOS process, making use of a disposable polysilicon spacer technology for MOSFET LDD formation. This new scheme allows independent optimization of active and link base regions while providing improvements in base-emitter breakdown and resistance to bipolar hot carrier degradation
Keywords :
BiCMOS integrated circuits; bipolar transistors; elemental semiconductors; integrated circuit technology; silicon; IC fabrication; MOSFET LDD formation; Si; advanced BiCMOS process; base-emitter breakdown; bipolar hot carrier degradation resistance; disposable polysilicon spacer technology; double polysilicon bipolar transistor; shallow link base; BiCMOS integrated circuits; Bipolar transistors; Boron; CMOS process; Degradation; Electric breakdown; Hot carriers; MOSFET circuits; Random access memory; Space technology;
fLanguage :
English
Journal_Title :
Electron Devices, IEEE Transactions on
Publisher :
ieee
ISSN :
0018-9383
Type :
jour
DOI :
10.1109/16.259621
Filename :
259621
Link To Document :
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