Silicon Micromachined W-Band Hybrid Coupler and Power Divider Using DRIE Technique

Author

Li, Y. ; Kirby, P.L. ; Offranc, O. ; Papapolymerou, J.

Author_Institution

Georgia Inst. of Technol., Atlanta

Volume

18

Issue

1

fYear

2008

Firstpage

22

Lastpage

24

Abstract

In this letter, a silicon micromachined W-band hybrid coupler and a power divider using deep-reactive ion etching (DRIE) technique are presented. They are designed in the H-plane of rectangular waveguide to utilize DRIE technique. The hybrid coupler adopts a ridged waveguide 90deg phase shifter and a joint waveguide. The power divider utilizes a T-shape configuration. The simulated and measured response of each circuit are presented in this letter where good agreement between them is achieved. Then, the measured combining efficiency is reported by cascading the power divider and the hybrid coupler.

Keywords

micromachining; phase shifters; power dividers; rectangular waveguides; sputter etching; waveguide couplers; H-plane rectangular waveguide; deep-reactive ion etching; phase shifter; power divider; silicon micromachined W-band hybrid coupler; Coupling circuits; Frequency; Micromachining; Phase shifters; Planar waveguides; Power dividers; Rectangular waveguides; Semiconductor waveguides; Silicon; Wet etching; Deep-reactive ion etching (DRIE); hybrid coupler; silicon micromachining;

fLanguage

English

Journal_Title

Microwave and Wireless Components Letters, IEEE

Publisher

ieee

ISSN

1531-1309

Type

jour

DOI

10.1109/LMWC.2007.911978

Filename

4408471