DocumentCode :
1018018
Title :
Silicon Micromachined W-Band Hybrid Coupler and Power Divider Using DRIE Technique
Author :
Li, Y. ; Kirby, P.L. ; Offranc, O. ; Papapolymerou, J.
Author_Institution :
Georgia Inst. of Technol., Atlanta
Volume :
18
Issue :
1
fYear :
2008
Firstpage :
22
Lastpage :
24
Abstract :
In this letter, a silicon micromachined W-band hybrid coupler and a power divider using deep-reactive ion etching (DRIE) technique are presented. They are designed in the H-plane of rectangular waveguide to utilize DRIE technique. The hybrid coupler adopts a ridged waveguide 90deg phase shifter and a joint waveguide. The power divider utilizes a T-shape configuration. The simulated and measured response of each circuit are presented in this letter where good agreement between them is achieved. Then, the measured combining efficiency is reported by cascading the power divider and the hybrid coupler.
Keywords :
micromachining; phase shifters; power dividers; rectangular waveguides; sputter etching; waveguide couplers; H-plane rectangular waveguide; deep-reactive ion etching; phase shifter; power divider; silicon micromachined W-band hybrid coupler; Coupling circuits; Frequency; Micromachining; Phase shifters; Planar waveguides; Power dividers; Rectangular waveguides; Semiconductor waveguides; Silicon; Wet etching; Deep-reactive ion etching (DRIE); hybrid coupler; silicon micromachining;
fLanguage :
English
Journal_Title :
Microwave and Wireless Components Letters, IEEE
Publisher :
ieee
ISSN :
1531-1309
Type :
jour
DOI :
10.1109/LMWC.2007.911978
Filename :
4408471
Link To Document :
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