• DocumentCode
    1018995
  • Title

    Internal Geometry Variation of LTCC Inductors to Improve Light-Load Efficiency of DC-DC Converters

  • Author

    Lim, Michele Hui Fern ; Van Wyk, Jacobus Daniel ; Liang, Zhenxian

  • Author_Institution
    Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ. Blacksburg, Blacksburg, VA
  • Volume
    32
  • Issue
    1
  • fYear
    2009
  • fDate
    3/1/2009 12:00:00 AM
  • Firstpage
    3
  • Lastpage
    11
  • Abstract
    A low-profile power inductor fabricated using low-temperature cofired ceramic (LTCC) technology has been demonstrated to improve the light-load efficiency of a converter, without the use of additional control circuitry. This is brought about by the material and the geometry, which causes a change in inductance with load current. Variation in inductor geometry is performed experimentally to study the effects on the light-load efficiency of a converter. By decreasing the conductor width of the inductor, the light-load efficiency can be further improved by 30% in comparison with using commercial inductors of similar inductance. Sufficient core thickness is necessary to have sufficient inductance, since an inductance value which is too low is detrimental from the system power loss point of view, as demonstrated experimentally. From the circuit point of view, there seems to be a critical inductance value, whereby increasing the inductance further, does not result in significant improvement in power stage efficiency. Changing conductor thickness in the range of 260 to 550 mum does not result in significant improvement in the overall efficiency of the converter. Variation in the number of parallel conductors in a multiconductor structure does not have significant effect on light-load efficiency improvement.
  • Keywords
    DC-DC power convertors; ceramic packaging; inductors; thermal management (packaging); DC-DC power electronics converters; LTCC inductors internal geometry variation; converter light-load efficiency; low-temperature cofired ceramic technology; multiconductor structure; power inductor fabrication; size 260 mum to 550 mum; thermal management; Distributed air-gap; geometry; light-load efficiency; low-temperature cofired ceramic (LTCC); passives; planar integration; variable inductance;
  • fLanguage
    English
  • Journal_Title
    Components and Packaging Technologies, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    1521-3331
  • Type

    jour

  • DOI
    10.1109/TCAPT.2008.2001683
  • Filename
    4695958