DocumentCode
1019311
Title
Aging problems of thermocompression bonds made to semiconductor devices
Author
Dodson, G.A.
Author_Institution
Bell Telephone Laboratories, Inc., Murray Hill, N. J.
Volume
9
Issue
6
fYear
1962
Firstpage
506
Lastpage
506
Keywords
Aging; Aluminum; Bonding; Electrons; Gold; Grain boundaries; Laboratories; Lead compounds; Magnetic field measurement; Magnetic switching; Semiconductor devices; Switches; Telephony; Wire;
fLanguage
English
Journal_Title
Electron Devices, IRE Transactions on
Publisher
ieee
ISSN
0096-2430
Type
jour
DOI
10.1109/T-ED.1962.15040
Filename
1473268
Link To Document