Title :
Rapid nondestructive thickness measurement of opaque thin films on anisotropic substrates
Author :
Crean, G.M. ; Waintal, A.
Author_Institution :
Centre National d´Etudes des Télécommunications, Meylan, France
Abstract :
A rapid, nondestructive opaque thin-film thickness measurement system is presented which takes into account the anisotropy of the sample under study and the geometry of the minature acoustic probe. Experimental results obtained using this system on W/Si (100) samples are in good agreement with those made using the Rutherford backscattering technique.
Keywords :
acoustic microscopy; elemental semiconductors; metallic thin films; silicon; thickness measurement; thin films; tungsten; ultrasonic materials testing; ultrasonic measurement; 100 samples; 375 MHz; US techniques; W/Si; acoustic microscopy; anisotropic substrates; miniature acoustic probe; nondestructive thickness measurement; opaque thin films; ultrasonic measurement;
Journal_Title :
Electronics Letters
DOI :
10.1049/el:19860036
