• DocumentCode
    1019697
  • Title

    Experimental investigation of the temperature dependence of InAs-AlSb-GaSb Resonant Interband tunnel diodes

  • Author

    Xu, Yanyang ; Fay, Patrick ; Chow, David H. ; Schulman, Joel N.

  • Author_Institution
    Dept. of Electr. Eng., Univ. of Notre Dame, IN, USA
  • Volume
    51
  • Issue
    7
  • fYear
    2004
  • fDate
    7/1/2004 12:00:00 AM
  • Firstpage
    1060
  • Lastpage
    1064
  • Abstract
    The temperature dependence of the current-voltage (I-V) characteristics of InAs-AlSb-GaSb resonant interband tunnel diodes (RITDs) has been investigated from 223 to 423 K. Several device structures were examined, with tunnel barrier thicknesses from 0.6 to 2.0 nm. For all barrier thicknesses, the peak current density (Jp) decreases slightly as the temperature is increased, while the valley current density (Jv) increases with temperature. We found that the temperature rate of change for the peak current density with temperature (∂Jp/∂T) is nearly independent of barrier thickness, while Jv increases more rapidly for devices with thicker barriers. In addition, the peak voltage (Vp) was found to be independent of temperature, regardless of barrier thickness. However, the valley voltage (Vv) was observed to decrease with increasing temperature, with more rapid changes observed for RITDs with thicker barriers. Comparison of the temperature performance of RITDs with different barrier thicknesses shows that devices with thinner barriers have I-V characteristics that are less sensitive to temperature, as well as having larger peak and valley current density and voltage for the temperature range from 223 to 423 K. To our knowledge, this is the first report of the temperature dependence of the device characteristics of Sb-based RITDs as a function of barrier width.
  • Keywords
    Auger electron spectroscopy; III-V semiconductors; X-ray diffraction; annealing; copper compounds; heterojunction bipolar transistors; indium compounds; scanning electron microscopy; semiconductor device metallisation; sputter deposition; tungsten compounds; 2 V; 25 h; 250 C; 40 nm; 400 C; 400 nm; 55 h; 550 C; Auger electron spectroscopy; CuWNAu; CuWNSiN; HBT wafers; InGaP-GaAs; WNX; X-ray diffraction; annealing; current accelerated stress test; diffusion barrier; heterojunction bipolar transistors; interconnect copper metallization; scanning electron microscopy; sheet resistance; sputtering method; tungsten nitride; Circuits; Current density; Diodes; Leakage current; Resonance; Resonant tunneling devices; Temperature dependence; Temperature distribution; Temperature sensors; Voltage; RITD; RTD; Resonant interband tunnel diode; resonant tunnel diode; resonant tunneling;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2004.829863
  • Filename
    1308626