• DocumentCode
    1019881
  • Title

    Optimization of alloy composition for high-performance strained-Si-SiGeN-channel MOSFETs

  • Author

    Olsen, Sarah H. ; O´Neill, Anthony G. ; Driscoll, Luke S. ; Chattopadhyay, Sanatan ; Kwa, Kelvin S.K. ; Waite, Andrew M. ; Tang, Yue T. ; Evans, Alan G R ; Zhang, Jing

  • Author_Institution
    Sch. of Electr. Electron., & Comput. Eng., Univ. of Newcastle, UK
  • Volume
    51
  • Issue
    7
  • fYear
    2004
  • fDate
    7/1/2004 12:00:00 AM
  • Firstpage
    1156
  • Lastpage
    1163
  • Abstract
    On-state and off-state performance of strained-Si-SiGe n-channel MOSFETs have been investigated as a function of SiGe virtual substrate alloy composition. Performance gains in terms of on-state drain current and maximum transconductance of up to 220% are demonstrated for strained-Si-SiGe devices compared with Si controls. Device performance is found to peak using a virtual substrate composition of Si0.75Ge0.25. MOSFET fabrication used high thermal budget processing and good gate oxide quality has been maintained for virtual substrates having Ge compositions up to 30%. Off-state characteristics are found to be more sensitive to strain relaxation than on-state characteristics.
  • Keywords
    MOSFET; Monte Carlo methods; ballistic transport; electron backscattering; nanotechnology; semiconductor device models; silicon-on-insulator; MOS devices; Monte Carlo methods; back-scattering; ballistic transport; double-gate MOSFET; electron scattering; nanotechnology; nonequilibrium transport; semiconductor device modeling; silicon-on-insulator; ultrashort-channel transistors; CMOS technology; Capacitive sensors; Fabrication; Germanium alloys; Germanium silicon alloys; MOSFET circuits; Performance gain; Silicon germanium; Strain control; Transconductance; Drain current enhancement; SiGe; mobility enhancement; n-MOSFETs; silicon-germanium; strained-Silicon; thermal budget; transconductance enhancement; virtual substrate;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/TED.2004.830656
  • Filename
    1308641