DocumentCode :
10224
Title :
Wavelength Selectable Hybrid III–V/Si Laser Fabricated by Wafer Bonding
Author :
Liepvre, Alban Le ; Accard, A. ; Poingt, F. ; Jany, C. ; Lamponi, Marco ; Make, Dalila ; Lelarge, F. ; Fedeli, J.-M. ; Messaoudene, S. ; Bordel, D. ; Duan, Guang-Hua
Author_Institution :
III-V Lab, a joint lab of Alcatel-Lucent Bell Labs France, Thales Research and Technology and CEA Leti, Palaiseau cedex, France
Volume :
25
Issue :
16
fYear :
2013
fDate :
Aug.15, 2013
Firstpage :
1582
Lastpage :
1585
Abstract :
This letter reports on a hybrid III–V on silicon arrayed waveguide grating laser, fabricated by a wafer bonding technique. The III–V materials provide the optical gain for the laser while an arrayed waveguide grating and Bragg reflectors on silicon on insulator complete the cavity for single mode selection and laser feedback. The laser shows a threshold current {\\sim}{\\rm 40}~{\\rm mA} , and a maximum coupled power to a single mode fiber of {-}{\\rm 2.2}~{\\rm dBm} . Independent lasing of five wavelength channels spaced by 392 GHz is demonstrated.
Keywords :
III-V laser; Photonic integrated circuit; hybrid laser; laser tuning; silicon-on-insulator (SOI) technology; wafer bonding;
fLanguage :
English
Journal_Title :
Photonics Technology Letters, IEEE
Publisher :
ieee
ISSN :
1041-1135
Type :
jour
DOI :
10.1109/LPT.2013.2271322
Filename :
6547642
Link To Document :
بازگشت