Aluminium-based packaging platform for led using selectively anodising method

Author

Kim, K.-M. ; Shin, S.H. ; Lee, Y.K. ; Choi, S.M. ; Kwon, Y.S.

Author_Institution

Korea Adv. Inst. of Sci. & Technol., Daejeon

Volume

44

Issue

1

fYear

2008

Firstpage

24

Lastpage

25

Abstract

An aluminium-based packaging platform with microreflector and electrical via for an interconnection electrode is first proposed for a package component of a light-emitting diode (LED). The electrode-guided interconnection with 180 mum thickness has been successfully fabricated by using the selectively anodising process, and not by either the plating or the solder paste technique. The reflector was formed during the isotropic etching process. By mainly a two-step chemical process, the LED packaging platform integrated microreflector and electrical via in one body was developed in a low-cost process.

Keywords

aluminium; electronics packaging; etching; interconnections; light emitting diodes; manufacturing processes; LED packaging platform; aluminium-based packaging platform; electrical via; electrode-guided interconnection; integrated microreflector; interconnection electrode; isotropic etching process; low-cost process; selectively anodising; size 180 mum; two-step chemical process;

fLanguage

English

Journal_Title

Electronics Letters

Publisher

iet

ISSN

0013-5194

Type

jour

DOI

10.1049/el:20081391

Filename

4415008