DocumentCode
1023382
Title
Comparative evaluation of DSP techniques coupled with electromagnetic time-domain simulators for the efficient modeling and design of highly resonant RF-MEMS structures
Author
Lee, Jong-Hoon ; Bushyager, Nathan ; Tentzeris, Manos M.
Author_Institution
Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
Volume
14
Issue
7
fYear
2004
fDate
7/1/2004 12:00:00 AM
Firstpage
361
Lastpage
363
Abstract
Four digital signal processing (DSP)-based digital predictors [Prony´s, covariance, forward-backward (FB), matrix pencil (MP)], that are commonly used to enhance the time-domain modeling and design of highly complex RF MEMS structures, are evaluated in terms of computational efficiency and accuracy as a function of the model order, the decimating factor, and the size of sample train. For a benchmarking case of an RF MEMS tuner, it is found that while covariance method has the best performance in terms of accuracy, MP method confers robustness to computational economies (less numerical effort) and saves more CPU time with a smaller model order that can be selected by easy and efficient criteria.
Keywords
covariance matrices; finite difference time-domain analysis; micromechanical devices; signal processing; DSP techniques; RF MEMS tuner; covariance method; decimating factor; digital signal processing-based digital predictors; electromagnetic time-domain simulators; finite-difference time-domain; forward-backward; highly resonant RF-MEMS structures; matrix pencil; model order function; prony; time-domain modeling; Computational modeling; Covariance matrix; Digital signal processing; Electromagnetic coupling; Electromagnetic modeling; Predictive models; Radiofrequency microelectromechanical systems; Resonance; Signal design; Time domain analysis; Covariance; DSP; FB; FDTD; MP; RF-MEMS; digital signal processing; finite-difference time-domain; forward-backward; matrix pencil; predictors; prony; time-domain modeling;
fLanguage
English
Journal_Title
Microwave and Wireless Components Letters, IEEE
Publisher
ieee
ISSN
1531-1309
Type
jour
DOI
10.1109/LMWC.2004.828012
Filename
1309695
Link To Document