Active Packaging Method for Light-Emitting Diode Lamps With Photosensitive Epoxy Resins

Author

Wang, Hao ; Lee, Kyu-Seung ; Ryu, Jae-Hyoung ; Hong, Chang-Hee ; Cho, Yong-Hoon

Author_Institution

Chungbuk Nat. Univ., Cheongju

Volume

20

Issue

2

fYear

2008

Firstpage

87

Lastpage

89

Abstract

A novel active light-emitting diode (LED) packaging method is presented. Our method utilizes the emission from the LED chip itself to package the LED with photosensitive epoxy. Such a photon-induced polymerization method, leading to the formation of specific lamp shapes and characteristics, eliminates the utilization of the mold. By controlling the packaging parameters, for example, the polymerization current and the polymerization time, the emission properties of the LED lamps can be controlled. It is found that the self-focusing effect plays an important role in the active packaging process.

Keywords

LED lamps; optical polymers; optical self-focusing; polymerisation; semiconductor device packaging; LED chip; active LED packaging; light-emitting diode lamps; photon-induced polymerization; photosensitive epoxy resins; polymerization current; polymerization time; self-focusing effect; Bonding; Curing; Electronic packaging thermal management; Epoxy resins; LED lamps; Light emitting diodes; Organic light emitting diodes; Polymers; Semiconductor device packaging; Shape; Encapsulation; light-emitting diode (LED); photosensitive epoxy resins; semiconductor device packaging;

fLanguage

English

Journal_Title

Photonics Technology Letters, IEEE

Publisher

ieee

ISSN

1041-1135

Type

jour

DOI

10.1109/LPT.2007.910760

Filename

4418429