DocumentCode
1028534
Title
Testing multichip modules
Author
Flint, Andrew
Author_Institution
Motorola Inc., Tempe, AZ, USA
Volume
31
Issue
3
fYear
1994
fDate
3/1/1994 12:00:00 AM
Firstpage
59
Lastpage
62
Abstract
Too complex to be tested as a chip and too packaged to be probed like a board, the multichip module presents a new set of challenges to the test engineer. The author describes how, until dedicated testers are developed, applying board-type tests using an IC tester will prove to be the most effective test methodology.<>
Keywords
boundary scan testing; hybrid integrated circuits; integrated circuit testing; multichip modules; IC tester; board-type tests; boundary scan; multichip module testing; test methodology; test vectors; Automatic testing; Circuit faults; Circuit testing; Electronic equipment testing; Integrated circuit packaging; Integrated circuit testing; Military computing; Multichip modules; Pins; System testing;
fLanguage
English
Journal_Title
Spectrum, IEEE
Publisher
ieee
ISSN
0018-9235
Type
jour
DOI
10.1109/6.265412
Filename
265412
Link To Document