• DocumentCode
    1028791
  • Title

    Localized temporary increase in material conductivity following impact ionization in a Gunn-effect domain

  • Author

    Heeks, John S. ; Woode, Alan D.

  • Author_Institution
    Standard Telecommunication Laboraories, Harlow, Essex, England
  • Volume
    14
  • Issue
    9
  • fYear
    1967
  • fDate
    9/1/1967 12:00:00 AM
  • Firstpage
    512
  • Lastpage
    517
  • Abstract
    It has been found that raising the applied bias on a long sample containing a high-field domain can result in a temporary increase in material conductivity over the region of the sample traversed by the domain while the higher bias was applied. The effect can be explained in terms of intrinsic impact ionization within the domain in the presence of a deep impurity level. The measured decay time of the "memory" is consistent with a capture cross section of about 10-15cm2, for electrons at the deep level, indicating that the empty center is neutral. Conversely, the filled center will have a high capture cross section for holes. Following intrinsic impact ionization in the domain the mechanism is believed to involve the rapid capture of holes at the filled centers and a subsequent relatively slow return of the extra electrons to the empty centers. The deep impurity level is thus responsible for fixing the memory in position in the material and also for inhibiting the emission of recombination radiation during impact ionization.
  • Keywords
    Charge carrier processes; Conducting materials; Conductivity; Electrons; Helium; Impact ionization; Impurities; Spontaneous emission; Time measurement; Voltage;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1967.15996
  • Filename
    1474719