DocumentCode
10294
Title
Simulations Based on the Cooptimization Procedure for Plated Contacts With a NiSi Interface
Author
Thibert, S. ; Jourdan, J. ; Bechevet, B. ; Chaussy, D. ; Reverdy-Bruas, N. ; Beneventi, D.
Author_Institution
MPO-Energy, Averton, France
Volume
5
Issue
3
fYear
2015
fDate
May-15
Firstpage
826
Lastpage
831
Abstract
A cooptimization procedure has been developed for industrial solar cells metalized using a nickel seed layer thickened by a plated silver layer. A theoretical contact resistivity model for NiSi nickel silicide contacts was first computed and inserted into classical power loss equations. Optical, resistive, and recombination losses were then simulated with a standard set of parameters used in production. This procedure allows the generation of efficiency and silver consumption contour plots for homogeneous and selective emitters. For both, general guidelines are given for the optimization of the doping profile, the finger spacing, and the finger thickness.
Keywords
doping profiles; electrical contacts; nickel compounds; semiconductor device metallisation; silicon; solar cells; NiSi; NiSi Interface; NiSi nickel silicide contacts; contact resistivity; cooptimization procedure; doping profile; finger spacing; finger thickness; homogeneous emitters; industrial solar cells; nickel seed layer; optical losses; plated contacts; plated silver layer; recombination losses; resistive losses; silver consumption contour plots; Conductivity; Doping; Nickel alloys; Photovoltaic cells; Silicides; Silicon; Silver; Light-induced plating (LIP); metallization; silicon solar cells; silver;
fLanguage
English
Journal_Title
Photovoltaics, IEEE Journal of
Publisher
ieee
ISSN
2156-3381
Type
jour
DOI
10.1109/JPHOTOV.2015.2414513
Filename
7076627
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