• DocumentCode
    10294
  • Title

    Simulations Based on the Cooptimization Procedure for Plated Contacts With a NiSi Interface

  • Author

    Thibert, S. ; Jourdan, J. ; Bechevet, B. ; Chaussy, D. ; Reverdy-Bruas, N. ; Beneventi, D.

  • Author_Institution
    MPO-Energy, Averton, France
  • Volume
    5
  • Issue
    3
  • fYear
    2015
  • fDate
    May-15
  • Firstpage
    826
  • Lastpage
    831
  • Abstract
    A cooptimization procedure has been developed for industrial solar cells metalized using a nickel seed layer thickened by a plated silver layer. A theoretical contact resistivity model for NiSi nickel silicide contacts was first computed and inserted into classical power loss equations. Optical, resistive, and recombination losses were then simulated with a standard set of parameters used in production. This procedure allows the generation of efficiency and silver consumption contour plots for homogeneous and selective emitters. For both, general guidelines are given for the optimization of the doping profile, the finger spacing, and the finger thickness.
  • Keywords
    doping profiles; electrical contacts; nickel compounds; semiconductor device metallisation; silicon; solar cells; NiSi; NiSi Interface; NiSi nickel silicide contacts; contact resistivity; cooptimization procedure; doping profile; finger spacing; finger thickness; homogeneous emitters; industrial solar cells; nickel seed layer; optical losses; plated contacts; plated silver layer; recombination losses; resistive losses; silver consumption contour plots; Conductivity; Doping; Nickel alloys; Photovoltaic cells; Silicides; Silicon; Silver; Light-induced plating (LIP); metallization; silicon solar cells; silver;
  • fLanguage
    English
  • Journal_Title
    Photovoltaics, IEEE Journal of
  • Publisher
    ieee
  • ISSN
    2156-3381
  • Type

    jour

  • DOI
    10.1109/JPHOTOV.2015.2414513
  • Filename
    7076627