Printed Dipoles Antennas for MCM-L Wireless RF Interconnects

We present the design of printed antennas on high-k substrate as an innovative concept of radio frequency (RF) MCM-L interconnects. We have chosen a dipole configuration printed on LaAlO material substrate and mounted on an Epoxy MCM-L substrate. Taking the excitation pads and substrate finite dimensions into account, electromagnetic tools are used to improve the antenna features at an operating frequency of 20 GHz. Propagating mode and electromagnetic interferences properties are evaluated in order to guarantee signal integrity in other circuits and in wire interconnects. Characterization of the proposed structures confirms our electromagnetic simulations predicting a dB transmission coefficient between antennas separated by 1 cm. Our solution presents a good transmission factor making it well suited for wireless RF interconnections which have been presented by the International Technology Roadmap for Semiconductors (ITRS) as a future solution to replace critical inter-chip communications. In addition to excellent transmission features, the proposed concept results in lower less electromagnetic interferences (EMI) in the MCM board.