DocumentCode

1031416

Title

Thermocompression bonding of external package leads on integrated circuit substrates

Author

Bolcar, V.P.

Volume

15

Issue

6

fYear

1968

fDate

6/1/1968 12:00:00 AM

Firstpage

421

Lastpage

421

Keywords

Assembly; Bonding forces; Copper; Gold; Integrated circuit packaging; Integrated circuit yield; Joining processes; Metallization; Silicon devices; Testing;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/T-ED.1968.16267

Filename

1475169