Title :
An integrated high-current silicon power switch
Author :
Sikina, Thomas V
fDate :
6/1/1968 12:00:00 AM
Keywords :
Assembly; Bonding forces; Copper; Gold; Integrated circuit packaging; Integrated circuit yield; Joining processes; Metallization; Silicon devices; Testing;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/T-ED.1968.16269
