• DocumentCode
    1031444
  • Title

    Wafer-chip assembly for large-scale integration

  • Author

    Kraynak, P. ; Fletcher, Peter

  • Volume
    15
  • Issue
    6
  • fYear
    1968
  • fDate
    6/1/1968 12:00:00 AM
  • Firstpage
    421
  • Lastpage
    422
  • Keywords
    Assembly; Bonding forces; Integrated circuit technology; Integrated circuit yield; Joining processes; Large scale integration; Metallization; Packaging; Silicon devices; Wafer bonding;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1968.16270
  • Filename
    1475172
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1031444