Title :
p-i-n isolation for monolithic integrated circuits
Author :
Vora, M. ; Chang, Jen-Yuan James
fDate :
6/1/1968 12:00:00 AM
Keywords :
Assembly; Bonding forces; Integrated circuit yield; Joining processes; Metallization; Monolithic integrated circuits; PIN photodiodes; Packaging; Silicon devices; Testing;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/T-ED.1968.16271
