• DocumentCode
    1031455
  • Title

    p-i-n isolation for monolithic integrated circuits

  • Author

    Vora, M. ; Chang, Jen-Yuan James

  • Volume
    15
  • Issue
    6
  • fYear
    1968
  • fDate
    6/1/1968 12:00:00 AM
  • Firstpage
    421
  • Lastpage
    421
  • Keywords
    Assembly; Bonding forces; Integrated circuit yield; Joining processes; Metallization; Monolithic integrated circuits; PIN photodiodes; Packaging; Silicon devices; Testing;
  • fLanguage
    English
  • Journal_Title
    Electron Devices, IEEE Transactions on
  • Publisher
    ieee
  • ISSN
    0018-9383
  • Type

    jour

  • DOI
    10.1109/T-ED.1968.16271
  • Filename
    1475173
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=1031455