Title :
Compliant bonding—A new technique for joining microelectronic components
Author :
Coucoulas, A. ; Cranston, B.H.
fDate :
6/1/1968 12:00:00 AM
Keywords :
Bonding; Diodes; Gallium arsenide; Gunn devices; Integrated circuit manufacture; Microelectronics; Oscillators; Solid state circuits; Testing; Voltage;
Journal_Title :
Electron Devices, IEEE Transactions on
DOI :
10.1109/T-ED.1968.16272
