DocumentCode

1031462

Title

Compliant bonding—A new technique for joining microelectronic components

Author

Coucoulas, A. ; Cranston, B.H.

Volume

15

Issue

6

fYear

1968

fDate

6/1/1968 12:00:00 AM

Firstpage

422

Lastpage

422

Keywords

Bonding; Diodes; Gallium arsenide; Gunn devices; Integrated circuit manufacture; Microelectronics; Oscillators; Solid state circuits; Testing; Voltage;

fLanguage

English

Journal_Title

Electron Devices, IEEE Transactions on

Publisher

ieee

ISSN

0018-9383

Type

jour

DOI

10.1109/T-ED.1968.16272

Filename

1475174